Thermal standardization on semiconductor packages - 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

Thermal standardization on semiconductor packages - 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

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This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.

This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.