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Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for reliability qualification plans for power semiconductor module

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1 Scope

This part of IEC 63287 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.

Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices.

This document is not intended for medical, military, aeronautics and astronautics-related applications.

NOTE    Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in 3.3.